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Yang, Y and Balaraju, JN and Huang, Y and Tay, YY and Shen, Y and Tsakadze, Z and Chen, Z (2014) Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation. Journal of Electronic Materials, 43 (11). ISSN 1543-186X