Balasingh, C and Singh, Vandana (1996) Measurement of Residual (Curing) Stresses in CFRP Laminates by the X-ray Diffraction Method13; 13;. Technical Report. National Aerospace Laboratories, Bangalore, India.
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Abstract
The fabrication of CFRP laminates from prepregs involves curing at elevated temperatures. Residual stresses are set up due to the difference in thermal expansion coefficient between the matrix and the fibre. In this i nvetigation, the x-ray diffraction method is used to measure curing stresses in CFRP laminates by incorpo- rating a very fine layer of aluminium particles during l ay up of the laminate. A calibration procedure is followed to correlate the strain in the crystalline particles, as measured by x-ray, with the composite strain amp; stress. Curing stresses measured by this technique are quite close to the value calculated from the differential coefficient of thermal expansion.
| Item Type: | Monograph (Technical Report) |
|---|---|
| Uncontrolled Keywords: | CFRP Laminates;Curing stresses;X-ray diffraction |
| Subjects: | CHEMISTRY AND MATERIALS > Chemistry and Materials (General) |
| Depositing User: | Mrs Manoranjitha M D |
| Date Deposited: | 14 Jun 2006 |
| Last Modified: | 24 May 2010 04:13 |
| URI: | http://nal-ir.nal.res.in/id/eprint/1818 |
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