Effect of strain on the thermomechanical behavior of epoxy based Shape memory polymers

Revathi, A and Sandhya, Rao and Kavitha, Rao V and Muralidhar, S and Sendil, Murugan M and Shylaja, Srihari and Dayananda, GN (2013) Effect of strain on the thermomechanical behavior of epoxy based Shape memory polymers. Journal of Polymer Research, 20 (5). pp. 1-10. ISSN 1022-9760

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The effect of deformation strain on the thermomechanical (TM) behavior of a commercially available bifunctional epoxy resin modified with 5 % carboxyl-terminated butadiene acrylonitrile (CTBN) was studied. The results were compared with those for the unmodified epoxy SMP. The glass transition temperatures (T g) as well as the moduli of these SMPs were determined. Static tensile tests were carried out at both 25 °C and 115 °C to study the effect of CTBN addition on the failure strain. TM cycling tests were conducted for two prescribed strain values: 15 % and 25 %. Further, the effect of the prescribed strain values and TM cycling on the shape-frozen and recovery responses of these SMPs were studied. In addition, microstructure studies were carried out in order to examine the dispersion of the CTBN and the fracture behavior of the CTBN-epoxy SMP. The results show that adding CTBN to the epoxy matrix leads to a slight reduction in storage modulus and T g. Static tensile tests revealed that there was a noticeable improvement in the failure strain of the CTBN-epoxy SMP when it was tested at 115 °C rather than at 25 °C. The cyclic thermomechanical tests performed here prove that the CTBN-epoxy SMP has a better endurance than the unmodified epoxy SMP, as well as enhanced shape-recovery characteristics.

Item Type: Article
Subjects: CHEMISTRY AND MATERIALS > Composite Materials
ENGINEERING > Fluid Mechanics and Thermodynamics
Depositing User: Mrs SK Pratibha
Date Deposited: 06 Aug 2018 08:28
Last Modified: 06 Aug 2018 08:28
URI: http://nal-ir.nal.res.in/id/eprint/12935

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