George, S and Goravar, S and Mishra, D and Shyamsunder, MT and Sharma, P and Padmasree, GK and Sanjeev Kumar, S and Bremond, P and Mukherjee, K (2010) Stress monitoring and analysis using lock-in thermography. Insight - Non-Destructive Testing and Condition Monitoring, 52 (9). 470-474(5). ISSN 1354-2575
Full text not available from this repository. (Request a copy)Abstract
An advanced non-destructive evaluation technique based on a thermal method and lock-in principles, known as thermoelastic stress analysis (TSA), is proposed for accurate stress measurements. Traditionally, strain gauges mounted on components of interest are used to measure stresses indirectly. In this paper, we describe the application of a thermoelastic stress analysis technique to a carbon-epoxy composite sample under dynamic loading to measure stresses. The advantages of this technique over strain gauges are described. The paper also describes methods for mapping of TSA results on CAD models and comparing the stresses with results obtained through finite element modelling.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Stress monitoring;Stress analysis;Thermoelastic stress analysis;strain gauges |
| Subjects: | CHEMISTRY AND MATERIALS > Composite Materials |
| Depositing User: | Ms. Alphones Mary |
| Date Deposited: | 25 Jan 2012 05:09 |
| Last Modified: | 25 Jan 2012 05:09 |
| URI: | http://nal-ir.nal.res.in/id/eprint/10250 |
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