An improved electroplating process for the preparation of soft nickel plated sealing disc.

Council of Scientific and Industrial Research, India (2000) An improved electroplating process for the preparation of soft nickel plated sealing disc. 107/DEL/92.

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Abstract

An improved electroplating process for the preparation of soft nickel plated-sealing disc which compriseselectroplating the sealing disc in a known manner, in an electroplating cell, comprising of a nickel anode, thesealing disc being the cathode mounted a jig placed in such a way that it can be reciprocated-parallel to the anode,having perforated mesh interposed between the anode and the cathode, characterized in that the novel electrolyteconsisting of:Nickel sulphate concentration, 800-900 ml/l.(containing 600 g/l)Boric acid, 20-30 g/lNickel chloride, 5-10 g/lSodium lauryl sulphate, 0.5-2 g/lPh 2.5-3.0Being pumped through a filter to the bottom of the cathode so that vertical jets of the electrolyte pass through the jig, thereby making the flow of the electrolyte uniform to get soft nickel plated sealing disc.

Item Type: Patent
Subjects: CHEMISTRY AND MATERIALS > Chemistry and Materials (General)
Division/Department: Surface Engineering Division, Surface Engineering Division, Surface Engineering Division, Surface Engineering Division, Surface Engineering Division
Depositing User: MS Jayashree S
Date Deposited: 31 Mar 2005
Last Modified: 24 May 2010 09:39
URI: http://nal-ir.nal.res.in/id/eprint/637

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