Effect of double reinforcements on elevated-temperature strength and toughness of molybdenum disilicide

Tantry, SP and Ramasesha, Sheela K and Lee, JS and Yano, T and Ramamurty, U (2004) Effect of double reinforcements on elevated-temperature strength and toughness of molybdenum disilicide. Journal of the American Ceramic Society, 87 (4). pp. 626-632. ISSN 0002-7820

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    Flexural strength and fracture toughness of molybdenum disilicide and its composites with 10 wt% TiB2 and 10 wt% TiB2 + 10 wt% SiC, synthesized by the hot-pressing technique, were evaluated as a function of temperature, ranging from ambient temperature to 1600xB0;C. Results show that the composites have higher strength and slightly lower toughness as compared with monolithic MoSi2 at room temperature. At high temperatures, the composites exhibit higher strength as well as higher toughness vis-xE0;-vis monolithic MoSi2. Among the composites, the double reinforcement of SiC and TiB2 was found to be more effective in improving the mechanical properties. A transition from brittle to ductile behavior was observed at temperatures greater than 1300xB0;C for all materials tested. The high-temperature mechanical behavior was found to be significantly influenced by the flow of an integranular glassy phase and the attendant cavity nucleation and growth along the grain boundaries. Micromechanisms responsible for the ambient as well as the elevated-temperature property improvement in composites are discussed with the aid of fractography.

    Item Type: Journal Article
    Uncontrolled Keywords: Double Reinforcements;Elevated Temperature;Molybdenum disilicide;Structural materials
    Subjects: CHEMISTRY AND MATERIALS > Inorganic, Organic and Physical Chemistry
    CHEMISTRY AND MATERIALS > Chemistry and Materials (General)
    Division/Department: Materials Science Division, Materials Science Division, Other, Other, Other
    Depositing User: Ms Indrani V
    Date Deposited: 04 Apr 2005
    Last Modified: 22 Aug 2012 14:39
    URI: http://nal-ir.nal.res.in/id/eprint/522

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