Effect of Benzotriazole on the microhardness of copper electrodeposits.

Vedanayaki, BK and Rajagopalan, SR (1986) Effect of Benzotriazole on the microhardness of copper electrodeposits. Journal of the Electrochemical Society of India, 35 (4). pp. 293-299.

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Abstract

The microhardness of copper electrodeposited from an acid sulphate bath with and without the addition agent, Benzotriazole (BTA), has been investigated. From a pure acid bath, the microhardness of deposit varies from 94 VHN to 10 VHN as cd is changed from 6. 5 mA/cm**2 to 39 mA/cm**2. When BTA is added, the microhardness varies from 200 VHN to 379 VHN as cd is changed from 6. 5 mA/cm**2 to 39 mA/cm**2. It is seen that profound increase in microhardness is brought about by the use of BTA as an addition agent. There are many factors which can affect hardness of metals, e. g. internal stress, grain size, banded structure, dispersion of fine particles etc. The role of these in hardness of electrodeposited copper is discussed in detail.

Item Type: Journal Article
Uncontrolled Keywords: Metals and alloys-Mechanical Properties;Banded structure;Structure;Benzotriazole;Microhardness;Copper and alloys
Subjects: CHEMISTRY AND MATERIALS > Chemistry and Materials (General)
Division/Department: Materials Science Division, Materials Science Division
Depositing User: Ms. Alphones Mary
Date Deposited: 24 Oct 2005
Last Modified: 24 May 2010 09:38
URI: http://nal-ir.nal.res.in/id/eprint/449

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