Morphological study of ternary Ni-Cu-P alloys by atomic force microscopy13;

Balaraju, JN and Anandan, C and Rajam, KS (2005) Morphological study of ternary Ni-Cu-P alloys by atomic force microscopy13;. Applied Surface Science, 250 (1-4). pp. 88-97. ISSN 0042-207X

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Abstract

Ternary electroless Ni-Cu-P alloy films were deposited by using nickel sulphate (B1)- and nickel chloride (B2)-based alkaline baths. Alloy films were characterized for their structure, morphology, chemical composition and microhardness. A single broad peak was obtained in XRD for both B1 and B2 films and the calculated grain sizes are 1.6 and 1.9nm, respectively. Optical microscopic examination of the deposited coatings revealed a less nodular structure for B2-based coatings. SEM micrographs showed that films were smooth and nodular. Compositional analysis made on these deposits using EDX and the chemical state identification by XPS showed that the coatings are almost identical. AFM studies showed that the deposits from B2 bath are comparatively smoother with less nodular structure. Microhardness measurements and potentiodynamic polarization studies in 3.5% NaCl solution showed that both deposits have similar properties. [All rights reserved Elsevier]

Item Type: Journal Article
Uncontrolled Keywords: Atomic force microscopy;Copper alloys;Corrosion;Crystal morphology;Electroless deposition;Grain size;Metallic thin films;Microhardness;Nickel alloys;Optical microscopy; Phosphorus alloys;Polarisation;Scanning electron microscopy; X-ray chemical analysis;X-ray diffraction;X-ray photoelectron spectra
Subjects: CHEMISTRY AND MATERIALS > Composite Materials
Division/Department: Surface Engineering Division, Surface Engineering Division, Surface Engineering Division
Depositing User: Mrs Manoranjitha M D
Date Deposited: 15 Mar 2007
Last Modified: 24 May 2010 09:54
URI: http://nal-ir.nal.res.in/id/eprint/4084

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