Ar+H2 plasma etching for improved adhesion of PVD coatings on steel substrates

Barshilia, Harish C and Ananth, A and Jakeer, Khan and Srinivas, G (2012) Ar+H2 plasma etching for improved adhesion of PVD coatings on steel substrates. Vacuum, 86 (8). pp. 1165-1173. ISSN 0042-207X

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    Abstract

    Ar+H2 plasma cleaning has been described for the surface modification of the steel substrates, which removes oxides and other contaminants from substrate surface effectively leading to a better adhesion of the physical vapor deposited (PVD) coatings. Approximately 1.1-1.3 μm thick TiAlN coatings were deposited on plasma treated (Ar and Ar+H2) and untreated mild steel (MS) substrates. A mechanism has been put forward to explain the effect of plasma treatment on the substrate surface based upon the data obtained from X-ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The XPS measurements on untreated and Ar+H2 plasma etched MS substrates indicated that the untreated substrate surface mainly consisted of Fe3O¬4, whereas, after etching the concentration of oxides decreased considerably. The FESEM and the AFM results showed changes in the surface morphology and an increase in the substrate roughness as a result of Ar+H2 plasma etching. Removal of oxide/contaminants, formation of coarser surface and increased substrate surface roughness as a result of Ar+H2 plasma etching facilitate good mechanical interlocking at the substrate surface, leading to a better adhesion of the deposited PVD coatings. The adhesion of TiAlN coating could be increased further by incorporating a very thin Ti interlayer.

    Item Type: Journal Article
    Subjects: PHYSICS > Physics(General)
    Division/Department: Surface Engineering Division, Surface Engineering Division, Surface Engineering Division, Surface Engineering Division
    Depositing User: Dr. Harish C. Barshilia
    Date Deposited: 14 Feb 2012 10:12
    Last Modified: 28 Mar 2012 09:11
    URI: http://nal-ir.nal.res.in/id/eprint/10029

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